BARREL REACTOR PLASMA SYSTEM – HERON 80

The Heron 80 plasma system is a reactor in a double-cage electrode configuration in which mainly chemical and isotropic etching processes take place. The plasma generated (using an RF source) gives rise to the creation of reactive ions.

The Heron 80 system is fully automated by means of a PLC that constantly monitors the status of the sensors, valves, flows, RF signal and pumping system. The only manual handling to be performed is the loading/unloading of samples.

This system is ideal for R&D or low- and medium-volume production, and is also designed to perform processes on substrates made of different materials such as metal, plastic, ceramics or paper.

Among the various treatments that can be implemented, the most significant are:

Semiconductors

Removal of photoresist (stripping) and photoresist residue (descumming), a photosensitive polymer used in photolithographic masking processes.
Organic incineration, isotropic removal of organic polymers (e.g. polyamides, etc.) and Silicon Oxides/Nitrides.
Surface cleaning or modification prior to wire bonding (both bond pads and chip carriers).
Isotropic etching
reverse engineering applications (removal of passivants, decapsulation and delineation of cross sections)

BioMedical

Cleaning and surface modification to obtain hydrophilic or hydrophobic surfaces, which can be used for example in the following application areas:

Selective filtration of biologic fluids
Prosthetic implants (increased wettability for faster osseointegration)
Bonding between different materials (needles on syringes, catheters, etc.).
Final ultrafine atomic level cleaning from organic residues after typical industrial cleaning cycles
Contact and intraocular lenses
Stents
Vials
Sterilisation on heat-sensitive materials

Plastics industry

Cleaning and surface modifications that can be used in the following application areas, for example:

Plastics bonding to plastics or other materials
Surface activation before painting , with possibility to eliminate the usage of Primers
Wettability before printing
Removal of organic residues after molding before painting/printing
Surface fluorination for enhanced functionality
Fluoridation of surfaces to modify functional characteristics

Solar (PV)

Isotropic removal of silicon nitride for isolation of cell edges
Isotropic removal of amorphous and multi-crystalline silicon
Possibility to process single cells or batches (rounded or squared up to 156 mm square)
Surface texturization of mono and multi-crystalline silicon for reflectivity reduction and efficiency enhancement.

Textile industry

Cleaning and surface modification of natural and synthetic fibres to increase the hydrophilicity of fabrics prior to dyeing or printing;

Precision Mechanics

Atomic final cleaning of metal and ceramic surfaces after industrial washing to improve their paintability or for other types of coatings (e.g. PVD).

Optics and ophthalmics

Final cleaning at atomic level and pre-treatment after industrial washing to improve adhesion of anti-reflective, anti-scratch and similar coatings; curing of anti-scratch and anti-fog layers.

Product features

Low cost of ownership
The touch screen display provides in real-time all the main information for excellent process control and rapid analysis
Able to process up to ten different editable recipes
Uniformity for Consistent Results
Datalogging capabilities, frequency <0,5 Hz, for historical condition of the process
Excellent process control and long term reliability and stability
Primary brands components used, such as vacuum gauges and mass flow controllers (MKS Instruments)
RF power level adjustable in the range 1W to 600W

Technical Specifications
Dimensions	L x P x A – Footprint	700 x 600 x 1750 mm
	Net Weight	130 Kg
	Respect distances	Right, Left, Front – 600 mm, Retro – 254 mm
Chamber	Material	Aluminum
Chamber	Max Volume	22.5 litri (1373 in³)
Electrode	Material	Aluminum
	Active work area/samle tray	239L x 250P mm
	Height	168 mm
RF Signal	Max output Power	600W
RF Signal	Frequency	13,56 MHz
Process Gases	Available flows	10, 20, 50, 100, 200 or 500 sccm
Process Gases	Max gases number	3 (Mass Flow Controller from MKS Instruments)
Control Interface	Control	PLC with Touch Screen Display
Control Interface	Remote control	Under development
Facility Service	Power supply	Three-phase + N + Earth 380/415 VAC, 32 Amax 50/60 Hz, 7 AWG Three-phase + N + Earth 208/240 VAC, 40 Amax, 50/60 Hz, 5 AWG
	Process Gas inlets, type and dimensions	6.35 mm (0.25 in.) OD Swagelok®
	Process gas pressure	from 1 bar (15 psig) min. to 3 bar (45 psig) max., regulated
	Purge Gas inlets, type and dimensions	6.35 mm (0.25 in.) OD Swagelok®
	Suggested Purge Gas	N2, Air
	Purge Gas Pressure	from 1 bar (15 psig) min. to 3 bar (45 psig) max., regulated
	Pneumatic Valve gas inlets, type and dimensions	6.35 mm (0.25 in.) OD Swagelok®
	Pneumatic Valve gas purity	Compressed Air, Oil Free, Dew point ≤7°C (45°F), particulate dimensions <5 μm
	Pneumatic Valve gas pressure	From 2 bar (30 psig) min. to 6 bar (90 psig) max., regulated
	Exhaust	NW 40 KF
Compliance	International	CE Marked

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